Electronic circuit board and semiconductor silicon wafer inspection equipment "AURCA Series"
AI inspection and measurement solution for electronic circuit boards and semiconductor silicon wafers: Introducing the "AURCA Series" appearance inspection equipment!
The "AURCA series" is the latest inspection solution that addresses challenges in manufacturing, such as detecting defects that were difficult to identify with conventional image inspection methods and improving yield, all at once. Please make use of it in your quality improvement cycle! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots
- Company：ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
- Price：Other
